May 6 2010
Sensofar-Tech, Terrassa, Spain and Leica Microsystems (Schweiz AG) have agreed to expand their cooperation whereby Sensofar is to supply technology and components for an optical system that complements Leica’s line of products for industrial applications.
The Leica DCM 3D Measuring Microscope combines confocal microscopy and interferometry in one sensor head, providing ultrafast and non-contact analysis of the micro- and nanogeometry of material surfaces to an accuracy of 0.1 nanometer.
Leica Microsystems will utilize the Sensofar technology plus Leica Microsystems’ high-end optical objectives to provide a new and complete solution for sophisticated optical profiling and 3D surface metrology with a vertical accuracy down to 0.1nm.
The Leica DCM 3D Dual Core 3D Measuring Microscope combines confocal microscopy, interferometry and color imaging in one sensor head. Due to two LED light sources and the innovative confocal microdisplay technology without mechanically moving parts, the measurement system is nearly maintenance-free. Features such as the compact, robust design, high-end optics from Leica Microsystems, a 17mm vertical scanning range and an outstanding vertical resolution down to 0.1nm makes the Leica DCM 3D an exceptionally powerful tool for non-contact, highly precise and ultra fast analysis of micro- and nanogeometries of technical surfaces. The system is suitable for a wide variety of measuring applications in R&D and quality assurance labs all the way through to automated online process control.
The cooperation between Sensofar and Leica Microsystems stems from a successful pilot project that was launched for the European market in 2008. Even during the initial pilot phase, several Leica DCM 3D systems found interested buyers for a range of applications. The two companies now plan to expand their cooperation, venture into additional markets and continue their joint development efforts.