Aug 19 2015
Himax Technologies, Inc., a leading supplier and fabless manufacturer of display drivers and other semiconductor products, today announced design-ins with key panel makers and OEMs for its best-in-class single-chip touch and display driver integration ("TDDI") solution, HiSIT™.
In addition to the existing shipment of out-cell and on-cell solutions, Himax's "HiSIT™" TDDI solution is ready for mass production and is expected to start shipping by the fourth quarter of 2015.
HiSIT™ could lower system level costs for panel makers and simplify supply chain management for OEMs. This single-chip solution will help handset makers deliver thinner, lighter, and sleeker designs with significantly enhanced performance. The industry is seeking cost effective and innovative display and touch solutions for smartphones and tablets, and HiSIT™ offers a state-of-the-art combination of Himax's highly recognized display driver and proven touch solution in a sophisticated structure that supports full in-cell touch displays for HD resolution smartphones and WXGA resolution tablets.
Jordan Wu, President and Chief Executive Officer of Himax Technologies, Inc., commented: "The industry is moving towards full in-cell panels driven by top-tier TFT-LCD makers seeking to introduce value-added innovations. Himax is one of the pioneers in offering one-chip TDDI solutions that requires significant integration complexity. We are excited about the projects awarded from these top tier customers, which demonstrates Himax's technological advancement and leading position in the latest full in-cell technology. We anticipate shipping our TDDI solution by the fourth quarter this year. Himax is in partnership with essentially all of the leading panel manufacturers for joint technological development of TDDI solutions, and we believe the Company will benefit from the rising TDDI trend, which should generate a more significant revenue contribution in 2016."