New Ceramic Optical Micro-Assembly from VI Systems

Developer of optical engines for data transmission, VI Systems has launched a new R40-850TB ceramic micro-assembly for maximum data rates of 45 Gbps.

The subassembly incorporates a transimpedance amplifier (TIA) integrated circuit, a multimode-fiber compatible photodetector chip and matching units. This combination enhances the signal transmission quality substantially.

VI Systems stated that it utilized the V40-850M vertical cavity surface emitting laser to demonstrate the receiver. The driver and TIA ICs of the optical subassemblies consume less than 130–150 mW at 40 Gbps each, enabling enhancement of the data centers’ energy efficiency.

The R40-850TB optical micro-assembly are utilized in applications such as chip-to-chip optical interconnects, very short-reach and short-reach systems. The Vertical Integrated Systems for Information Transfer (VISIT) project funded by the European Union’s Seventh Framework Programme supported the optical subassembly development. The members of the VISIT group are the Ioffe Physical Technical Institute, The Technical University of Berlin, University College Cork, The University of Cambridge, Chalmers University of Technology, VI Systems, IQE and Intel.

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