RGBLase, LLC, a leading manufacturer for OEM laser modules and photonic total solution provider, today announced the introduction of a new product family: the FreeBeam series of free space semiconductor laser module. The FreeBeam series combines high performance semiconductor laser diode, optical collimation and beam correction system, high efficiency temperature control electronics, laser power monitoring and laser diode drive electronics into a compact size.
Nextreme Thermal Solutions, announces the availability of a new thermoelectric module - the Ultra-High Packing Fraction (UPF) OptoCooler module - that addresses the latest cooling and temperature control requirements for optoelectronics, electronics, medical, military and aerospace applications.
Cleanfield Alternative Energy Inc. is pleased to announce that its wholly-owned subsidiary, Cleanfield Energy Corp, has developed a strategic partnership with McMaster University's Department of Engineering Physics by way of a research collaboration agreement dated December 18, 2007 between Cleanfield, McMaster and the Ontario Centres of Excellence Inc.. The project is being partially funded by OCE's Centre for Photonics. OCE is a not for profit organization partially funded by the Government of Ontario.
QPC Lasers, Inc., a world leader in the design and manufacture of high brightness, high power semiconductor lasers for the consumer, industrial, defense, and medical markets, today announced that it will showcase its next generation products and technologies at the SPIE Photonics West Conference and at the Biomedical Optics (BIOS) Exhibition on January 19-24th in San Jose, CA.
Braggone, the optoelectronics materials company, has signed a joint development agreement with equipment supplier Beneq that offers a turnkey solution to provide a custom matched material and toolset for the maximum manufacturing efficiency and product performance of solar cells.
Tessera Technologies, Inc., a leading provider of miniaturization technologies for the electronics industry, today announced that it has licensed its OptiML™ Wafer-Level Camera (WLC) technology and SHELLCASE® Wafer-Level Chip Scale Packaging (WLCSP) solutions to Nemotek S.A. The combination of these consumer optics technologies enables Nemotek to offer a full range of cost-efficient camera solutions from wafer-level packaging of image sensors and wafer-level lenses to fully-integrated camera modules.
RIO today announced product availability of a narrow spectral linewidth, low phase noise laser, housed in an industry-standard 14-pin butterfly package, specifically designed for fiber optic sensing applications.
Looking to capitalize on the rapidly growing market for optical technologies and instrumentation in the life sciences, PennWell Corporation has officially launched its latest venture, BioOptics World. The new magazine and web site are now live and available at www.bioopticsworld.com.
ColorChip, a leading developer and provider of fiber optics components based on PLC technology, announced today the release of a GEPON (EPON) PX10 Triplexer transceivers for the FTTH market.
ColorChip, a leading developer and provider of fiber optics components based on PLC technology, announced today the release of the Meteor II GPON Class A+ diplexer transceiver for the FTTH market
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