Jun 9 2010
Aptina has introduced a new, advanced System-on-Chip (SOC) imaging solution called the MT9M114 720P HD for video applications. The MT9M114 runs at 30 frames at each second and features a one-sixth optical format, which allows cameras with low-profile modules to meet thin sub-4 mm height requirements easily and effectively. This optical format makes the MT9M114 suitable for TVs, monitors, notebooks and Netbooks, which are integrated with web cameras.
The MT9M114 SOC features a 1.9-micron pixel, which is equal to the performance of a 3.6-micron pixel. The 1.9-micron pixel offers advanced high-definition (HD) video running at 60 frames per second (fps) when summing up in Video Graphics Array (VGA) mode. The 1.9-micron pixel also compliments the feature set in the SOC. The feature set is embedded into the MT9M114 to provide optimum video experience.
The MT9M114 also addresses the problems related to web-camera exposure conditions such as 3CCM Auto White Balance (AWB), adaptive backlighting and weighted average exposure to adjust to all types of lighting environments. The MT9M114 also has an exceptional perspective correction function that reduces the need of adjusting the camera positions physically.
Aptina’s General Manager, Farshid Sabet, informed that the MT9M114 is specifically designed for high-definition video communication that addresses both tethered and integration applications. He added that the combination of sophisticated functions and performance is suitable for portable equipment users, and provision of the MT9M114 in an SOC format reduces the process of system engineering development and accelerates their clients’ time to market.
The MT9M114 incorporates a number of sophisticated functions such as a multi-camera synchronization, an Image Flow Processor (IFP) and camera-control features. The camera-controlled features can be combined with a wide range of USB backend integrated circuits (ICs) without compromising on the performance of the camera. The MT9M114 SOC comes in a CSP packaging and the mass production of the chip will begin on third quarter of 2010.