May 12 2010
Molex has introduced the new LED Printed Circuit Assemblies. These custom-lighting solutions integrate the company’s expertise in designing and manufacturing both Printed Circuit Assembly and LED. The reliable and efficient solutions work effectively for LED subassemblies used in various sectors.
The company will showcase the LED Printed Circuit Assemblies at the LIGHTFAIR International conference that will take place in Las Vegas between May 12 and 14. The new LED assemblies have the ability to support flexible and robust circuits that are used in the packaging of LED products.
The lighting solutions endorse backlighting applications having polyester circuits that support low power applications and also rigid, heat sinked polyimide boards that support applications consuming high power, namely, surgical and automotive lighting.
The company’s teams for design and manufacturing use the in-house capabilities in design, manufacturing and test to produce the assembly solutions. Molex also offers proficiency in BIN control, which is used to test the consistency of luminosity output ranges of LED.
Molex’s associate product manager, Julian Ladron de Guevara said that the new LED assemblies mark the company’s next step in the continuous search for offering efficient and high-quality LED solutions to the fast growing market. The company’s 20-year experience and expertise in manufacturing will help it to be a main player in the lighting industry, Guevara added.