Saki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, announces significant enhancements to the image processing capabilities of its 3Xi-M200 X-ray Automated Inspection (AXI) system. The latest software update introduces advanced functions that improve inspection accuracy for solder joint defect in complex power module assemblies. When combined with Saki’s existing shadow correction filter, which addresses challenges associated with heat dissipating pin-fin structures, the update further reinforces Saki’s capability in high-precision X-ray inspection for complex power modules, including those with thick, heat-dissipating finned baseplates.
Comparison of X-ray images before and after noise cancellation: enhanced image clarity enables more accurate void detection in power modules with heat-dissipating pin fins. Image Credit: Saki Corporation
In power modules, solder joint quality is critical to reliability. In particular, voids in the solder layer can significantly impact thermal and electrical performance, making high-resolution, high-sensitivity X-ray inspection essential for quality assurance in manufacturing lines.
Power modules, which manage high currents and voltages, typically incorporate complex thermal designs such as large power devices and finned heatsinks to ensure efficient heat dissipation. These architectures often result in significant height variations and intricate, multi-layered structures that include solder layers and heatsinks. Such complexity poses a challenge for conventional 2D X-ray imaging, which are unable to effectively detect defects within such structures with sufficient accuracy. Saki’s 3Xi-M200 AXI system overcomes these limitations with its unique planar CT technology, which separates individual layers to enable highly accurate void detection and defect analysis, even in densely structured assemblies.
The 3Xi-M200 system is equipped with a high-power X-ray source capable of penetrating thick baseplates. It has been widely recognized for its advanced noise filtering capabilities, which eliminate interference caused by heat-dissipating pin fins and enable high-resolution, high-contrast imaging. The latest software update further enhances performance by introducing the Brightness Offset Filter, which adjusts for brightness fluctuations resulting from structural height variations within a module. This advanced feature contributes to clearer, more stable imaging, particularly in complex modules, further supporting precise void detection and improving overall inspection accuracy.
Yoshihiro Akiyama, Director and Executive Fellow at Saki Corporation, commented: “As the power module market continues to expand, substrates with heat-dissipating pin fins are drawing renewed attention for their flexibility in balancing cost and performance. In response to evolving demands, especially in automotive applications, we have continued to refine our inspection technology. Since 2011, Saki has delivered specialized X-ray inspection solutions tailored to this sector and has earned strong recognition from leading power module manufacturers. Through our commitment to in-house hardware and software development, we remain focused on enhancing our inspection system capabilities to support quality assurance and performance in power electronics manufacturing.”