Chromasens, a brand of TKH Vision, has released its 3DPIXA pro dual 200 µm camera that merges line scan imaging technology with fast 3D stereo computation. Its 55-inch (1400 mm) field-of-view addresses a number of inspection and measuring challenges that arise in the scanning of large, complex, or irregularly shaped objects for flaws.
Image Credit: Chromasens GmbH
Boasting line rate speeds of 29.7 kHz and optical resolution of 200 µm/pixel, the 3DPIXA pro dual 200 µm camera simultaneously captures 2D color images along with a height map or 3D point cloud to realize unmatched quality inspection capabilities a wide spectrum of applications, such as food processing, automotive production, and natural products like wood pieces or ceramic tiles. The camera is also able to detect overlapped or non-aligned parts, as it displays different colors on the depth map based on height differences. Imaging performance is enhanced by the incorporation of an advanced trilinear CCD line RGB sensor with 10 μm x 10 μm pixels, and the adaptable Camera Link interface.
The 3DPIXA pro dual 200 µm significantly reduces overall operational costs by improving efficiencies in product validation. For instance, in automotive manufacturing, the camera optimizes surface inspection of large body panels for cosmetic flaws like dings, dents and wrinkles, or for detection of functional flaws such as irregularities on the bearing surfaces of rocker arms or the correct spacing and size of mounting holes on disk brake pads. This reduces scrap and the cost of manual inspection leading to a faster return on investment.
The 3DPIXA pro dual 200 µm greatly simplifies the process of configuring 3D systems with support for libraries from HALCON (MVTec), MIL (Matrox), LabVIEW (National Instruments), and Coake (SAC), in addition to Chromasens' own 3D-API. Built to thrive in tough industrial settings, the IP50 rated camera has a sturdy housing that measures only 220.3 x 463 x 98.5 mm for space-sensitive environments.
The Chromasens 3DPIXA pro dual 200 µm reflects the company's commitment to imaging innovation, setting higher standards for 3D inspection, and driving advancements in machine vision.