Mar 13 2013
3S PHOTONICS, a world-leading manufacturer in optical and optoelectronic components for telecommunication networks, and Finisar Corporation, the world's largest supplier of optical communication components and subsystems, today announced their formal agreement to launch a partnership for the development of a new packaging platform for 980nm cooled laser pump modules.
Under this agreement, 3S PHOTONICS will be the exclusive supplier of the 980nm laser chips used for this platform, and Finisar will implement a manufacturing line based on this platform in its newly expanded facilities in Wuxi, China. Finisar will use these 980nm pump modules in their industry-leading EDFA and Line Card products for the telecom market. 3S PHOTONICS will use the packaging platform to serve its own customers.
Alexandre Krivine, CEO of 3SPGroup, commented: "We are very pleased to launch this agreement which will allow 3S PHOTONICS to gain access to an alternative competitive packaging platform that will improve the fixed cost absorption of our wafer fab. We are proud to be selected as the sole supplier by Finisar for these high power applications, which is recognition of the leading performance and reliability of our 980nm chips."
"This partnership provides Finisar with strategic access to high performance and highly reliable 980nm chips while leveraging our own expertise in high-volume, cost-effective manufacturing," said Eitan Gertel, CEO of Finisar. "This combination allows us to quickly provide the products that our customers are demanding to support growing telecom networks."
The 980nm lasers supplied by 3SPGroup are already fully qualified with outstanding field reliability. The availability of the modules resulting from this new packaging platform is expected by mid-2013.