JPSA has launched a highly-flexible JPSA picosecond laser platform that has been created to accommodate multiple types of ultrafast lasers to provide appropriate laser for specific application.
IX-6168 Picosecond Laser Micromachining System
Safely housed within the workstation’s slide-out service trolley, the IX-6168-PS laser is fully integrated with the system control software. Laser is available in choices like Infra-red (IR), green or UV wavelengths, in addition to being offered in range of power and pulse rate options.
JPSA offers a dual beam delivery configuration to attain maximum tool flexibility. A fixed-beam configuration generating highly focused beam is effective for precision machining. Precision air-bearing stage ensures precise feature positioning. A high-precision galvanometer configuration with in-built step-and-scan function can be used as an option for accelerating processing of complex shapes. The IX-6168-PS includes fixed beam as well as galvanometer scanning capability, and can be customized for specific needs.
Ultrafast laser processing features provide shorter pulse duration compared to the thermal diffusion timescale of the material. This leads to direct transition from solid to vapor, thereby minimizing debris formation, and thermal impact on its vicinity.
The IX-6168-PS can be offered as a manual-load system, or integrated with JPSA’s Integrated Automation Platform for achieving fully automated operation in semiconductor wafer applications. It is available in a variety of configurations such as power and repetition rate, laser wavelength, and a choice of galvanometer scanner and lens systems to maximize large deflection field applications.
The products and services of JPSA encompass optical damage testing, UV excimer, DPSS and ultra-fast laser micromachining systems, laser materials processing development, UV and VUV laser beam delivery systems, and excimer laser refurbishment services.