Palomar Technologies, a renowned global supplier of precision optoelectronic and microelectronics packaging systems, declared the development of a precision eutectic process for direct attach light emitting diodes (LEDs).
PALOMAR TECHNOLOGIES, INC. LEDS Direct-attach LEDs via eutectic Au/Sn to a single 50mm metal core carrier. (PRNewsFoto/Palomar Technologies, Inc.) CARLSBAD, CA UNITED STATES
According to the General Manager of Palomar Technologies Assembly Services, Donald Beck, the advanced version of solid-state LED emitters are the Direct-attach LEDs. These innovative LEDs offer advanced solutions for customers and markets concerned with various general illumination needs and related applications like camera flash and TV backlighting.
Over 390 700 µm LEDs, integrated to a single 50 mm metal core carrier with an Au/Sn solder, are being leveraged by Assembly Services. The Pulsed Heat System of Palomar Technologies plays a key role in this development. This novel system facilitates precision die attach systems to manage LED exposure more efficiently than with other related systems. The direct-attach LEDs’ bondpad-down design upgrades thermal management, without using any wire bonds.
Palomar Technologies will showcase its novel products at Strategies in Light 2012, an LED-focused show at Santa Clara, CA, scheduled between February 7 and 9. The existing packaging capabilities of LEDs, their efficiency and performance and the recent developments at Palomar Technologies such as the direct-attach LED eutectic bonding will be demonstrated at the show by Julie Adams, Director of WW Assembly Services Sales.
At the same time, Palomar Technologies will display its products at another event in San Diego, CA called IMAPS RF 2012, where it will function as a premier sponsor. On February 8, 2012, Western Americas Sales Manager, Bradley Benton will present an outline of the innovative solutions and advanced RF automated packaging processes being developed at Palomar Technologies.