Nordson DAGE, a provider of bond test equipment and digital X-ray inspection systems for the semiconductor and printed circuit board assembly industries, has won a Global Technology Award for its bond equipment, the 4000Plus Bondtester Pad Cratering Inspection System.
Nordson DAGE 4000Plus Bondtester
The company was bestowed with the award at a ceremony held on November 15, 2011 at the Productronica 2011 held in Munich, Germany at the New Munich Trade Fair Centre.
The Nordson DAGE 4000Plus Hot Bump Pull system is completely integrated on to a standard 4000Plus system as a single load cartridge. The Hot Bump Pull conforms to the JEITA ET-7407A and the IPC-9708 standards. A mechanism for clamping pins and cooling and heating stages are integrated into the cartridge.
The 4000Plus Bondtester Pad Cratering Inspection System features high repeatability and data accuracy. The technology of the system caters to the requirements of fatigue and bend testing, pad cratering utilizing hot pin pull and ribbon pull test applications. The Bondtester incorporates Paragon software and provides automatic GR&R calculation, advanced data reporting, and semi-automatic test routines. It also provides a unique engine wizard for database search.
Nordson DAGE’s XD7600NT Diamond FP X-ray inspection system received recognition in the category for X-ray inspection. The Global Technology Awards program commenced in 2005 and is an annual event that recognizes product excellence in surface mount assembly of electronic products.