Dow Corning Develops OE-6370 Series Optical Encapsulant with Low Thermal Hardening Properties

Dow Corning Electronics Solutions has introduced the Dow Corning OE-6370 Series Optical Encapsulant to its range of two-part methyl silicone elastomer encapsulants used for the manufacture of light emitting diodes (LED).

The OE-6370HF has been designed for overmolding, with faster curing and higher viscosity while the OE-6370M has been developed for supplying lower viscosity, dispensing and an increased pot life.

The OE-6370 encapsulant is well-suited for situations where conventional methyl silicone elastomer encapsulant materials are inadequate, thus providing greater hardness stability; enhanced low volatility; and increased throughput processing. LEDs manufactured by Dow Corning using the OE-6370 series provide good light transmission due to its resistance to yellowing and translucent appearance.

The Global Industry Director of Dow Corning Electronics, Kaz Maruyama stated that the use of the OE-6370 series assures improved reliability for adhesion due to their lower thermal hardening thus reducing wire breaking and cracking issues.