Molex Showcases HSC CXP Copper and Optical Systems at DesignCon 2011

Molex has showcased a new High-Speed Channel (HSC) CXP copper and optical solution at the DesignCon 2011 conference that was held in Santa Clara.

The iPass+ HSC CXP copper and optical system provides cables and connectors, which attain maximum data rates of 120 Gbps over 12 lanes in a single assembly. The HSC solution offers 10 lanes of 10 Gbps data rates and was adopted as the 100G Ethernet standard by IEEE 802.3ba.

iPass CXP Copper and Optical System

Molex has utilized compliant-pin tails and high data-rate capable wafer technology to manufacture two integrated connectors for the server-storage market. The standard version is a 12-channel connector that has the potential of attaining 10 Gbps Quad Data Rates (QDR). The enhanced footprint version is a 10-channel connector that conforms to the IEEE 802.3ba needs for the 100 Gigabit Ethernet interface. The enhanced version also offers a path for future terabit networks.

Molex’ other iPass+ HSC CXP solutions include optical module assemblies, active optical cable (AOC) assemblies, copper cable assemblies, and a stacked dual-port connector. The company’s Global Product Manager, Larry Schultz stated that the iPass+ HSC CXP solution enables switch and server manufacturers to offer high data-rate capable channels and deliver a better solution for end-users.

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