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Helios Crew Rolls Out MEMS-Integrated S35 LED Packaged Component

Taiwan-based company, Helios Crew has rolled out a new packaged component LED called the S35 that combines semiconductor processing and MEMS to create a new silicon packaging technology.

LED product S35

The company is a subsidiary of SemiLEDs, which is a US-based manufacturer of LED chips, marketed on Nasdaq under the LEDS symbol.

The silicon sub-mount technology combines a high-brightness SemiLEDs chip and offers both reliability and brightness. The compact S35 silicon exhibits over eight times more thermal conductance than aluminum oxide ceramic packages. In addition, it is cost-effective compared to aluminum nitride ceramic.

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