Posted in | News | Laser

Ultratech Launches LSA101 Laser Spike Annealing System

Supplier of laser processing systems, Ultratech has introduced a new laser spike annealing (LSA) system that allows important annealing uses for the 28-nm node production.

The LSA101 LSA system includes advanced coherent optics that produces a focused, long beam of laser at the wafer plane to offer the ability to maximize throughput by about 200% than the LSA100A system.

Ultratech’s LSA101 can reduce the annealing time by a factor of two in contrast to the LSA100A system. The laser spike annealing system reduces ownership cost by 65%. At present, a consumer in Asia is testing the LSA101 for 28-nm production. The LSA101 features a dwell time as low as 200 µs and a broad operating range for dwell time or annealing time.

Ultratech’s VP of Laser Product Marketing, Jeff Hebb, Ph.D. stated that the LSA101 incorporates the long-wavelength technology as the LSA100A. He added that the LSA101 offers enhanced closed-loop wafer temperature control, layout-independent process results, and within-die uniformity.

Tell Us What You Think

Do you have a review, update or anything you would like to add to this news story?

Leave your feedback
Your comment type
Submit

While we only use edited and approved content for Azthena answers, it may on occasions provide incorrect responses. Please confirm any data provided with the related suppliers or authors. We do not provide medical advice, if you search for medical information you must always consult a medical professional before acting on any information provided.

Your questions, but not your email details will be shared with OpenAI and retained for 30 days in accordance with their privacy principles.

Please do not ask questions that use sensitive or confidential information.

Read the full Terms & Conditions.