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Radian Laser Systems Files New Patent for Laser Process Technology

Editorial Checklist

Reviewed

Nov 10 2010

Radian Laser Systems announced that the Chief Scientist Wayne Shaffer has filed a new patent that will revolutionize the technology of laser engraving and marking of various materials and metals. The company will showcase the technology at the Munich Laser World of Photonics, in May 2011.

Radian is in talks with prospective strategic partners to collaborate for the utilization of the technology in a more comprehensive way. A 10 W laser using the patent-pending technology would exhibit the throughput and power of a laser functioning at 20 - 50 W.

Shaffer stated that the process technology changes a laser beam’s nature of interaction with a material. He added that the technology improves the effective energy by 2-5 times, as determined by material removal, without increasing the corresponding power.

Source:

http://www.radianlaser.com/

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