Hynix to Use ESI’s Laser Link Processing System for DRAM Production

Memory semiconductor supplier, Hynix Semiconductor has placed a major order for ESI’s9850TPIR+ (tailored-pulse infra-red plus).

ESI provides laser-based manufacturing products for the microtechnology industry. Hynix intends to use the laser link processing system to increase the production of embedded memory and DRAM devices.

The 9850TPIR+ laser link processing system is ideal for high volume manufacturing environments for various embedded memory and DRAM devices. The laser system uses ESI’s patented tailored-pulse laser technology. The technology incorporates high repetition rates and greater resolution temporal pulse profiling to support the most challenging and the latest fuse designs. The laser link processing system offers fast fuse blowing and surpasses the precision needs for 40 nm class DRAM production.

Hynix Semiconductor’s Director of the test engineering team, Seong Dong Lee stated that the company is pleased with the flexibility of the laser link processing system. Lee added that the high productivity achieved with the 9850TPIR+ would aid the company to meet its objectives of low ownership cost for embedded memory and DRAM applications.