Jun 30 2010
Aries Electronics has announced its new CSP test socket that is used for failure analysis (FA) testing for optical sensor, or EMMI (emission microscopy) applications. The test socket features a window, through which the complete top surface of the device under test (DUT) is optically exposed.
CSP Optical FA Test Sockets from Aries Electronics
The test socket line can hold various optical lens and window materials such as clear plastic, sapphire, and quartz crystal, however, depending on the operational requirements. The socket window utilizes a V077 optical quartz glass, which has a transmission rate ranging from <260 nm in near UV (ultraviolet) to >2,000 nm in IR (infrared). The socket matches any type of socket footprint, enabling the PCB for FA testing and other combined testing necessities. The test socket supports IC devices from 0.75 mm2 size and above; and IC pitch from 0.30 mm and above.
The sockets are offered with/without filters for IR, full spectrum, and UV applications. The socket can be utilized for laser FA microscopy testing with the help of LSIM (laser signal injection microscopy) and EMMI techniques. These FA techniques are tools for non-invasive optical analysis for the detection and localization of IC failures.