May 13 2008
Tokyo Electron Device Limited (TED) has today announced the inrevium "TB-3S-1400AN-IMG/TB-3S-3400DSP-IMG", an imaging application evaluation platform equipped with Xilinx Spartan-3 AN/A-DSP FPGA.
“In recent years, imaging applications have penetrated every market ranging from broadcasting, industrial and medical devices to surveillance devices, automobiles, and consumer audio-visual devices, and imaging interface development as well as image processing algorithm development in accordance with each application are accelerated,” said Toshiaki Sunagawa, president and representative director of TED. “At the development side, faster development turnaround in response to shorter product lifecycles is demanded and at the same time, issues concerning manufacturing costs and maintenance have been pointed out, such as the requirement of a dedicated image processing PC for graphic user interfaces (GUI) such as touch panels in embedded devices.”
The inrevium TB-3S-1400AN-IMG/TB-3S-3400DSP-IMG supports the development of FPGA design in any kind of products that require image processing. Furthermore, TED also provides turnkey solutions cooperatively with IP partners and a wide variety of optional boards, in addition to the evaluation board.
IPs such as H.264 Encoder, Face Recognizer, Video Stabilizer, Dynamic Range Correction/Noise Reduction and GUI development environments for embedded devices are available. Various optional boards for a wide range of target applications including DVI, USB, CameraLink, and Analog video interfaces are also available. These enable to reduce a risk associated with the development efforts that use the latest FPGA and realize efficient functional evaluation of target applications, and enabling time-to-market.
TB-3S-1400AN-IMG/TB-3S-3400DSP-IMG main features:
- FPGA: Xilinx XC3S1400AN/XC3SD3400A-4FGG676C
- 32M x 16bit (512Mbits) DDR2 SDRAM x4
- 8M x 8bit (64Mbits) Flash memory
- 10/100/1000 BASE Ethernet Ports x2
- Connector for touch panels, VGA output
- Expansion ports for optional board x2
- Reference design of DDR2 SDRAM frame buffer design (Verilog HDL) and graphic controller (VHDL)
TED will demonstrate various image processing applications on this board at “Embedded System Expo (ESEC)”, May 14-16 in Booth # East 38-16 of the Tokyo Big Sight, Tokyo, Japan.
Pricing and Availability
The inrevium TB-3S-1400AN-IMG/TB-3S-3400DSP-IMG is available now, with a price at US$1,440 and US$1,980. For more information, please visit https://www.teldevice.co.jp/eng/