Mar 11 2016
Ultratech, Inc., a leading supplier of lithography, laser-processing and inspection systems used to manufacture semiconductor devices and high-brightness LEDs (HB-LEDs), as well as atomic layer deposition (ALD) systems, today announced that it has received a follow-on order from one of the largest foundries in Asia for its LSA101 laser spike anneal system.
This win extends the company's leadership position in Asia and builds on the existing installed base of Ultratech's LSA systems currently utilized at multiple sites by this foundry customer. The LSA101 system, which will be used for 28-nm production is expected to ship in the first quarter of 2016.
"Historically, the semiconductor industry's growth depended on a reduction in cost per transistor with each migration to smaller nodes, but this cost reduction trend wasn't realized with the shrink below 28nm. This is one of the most serious challenges the industry has faced in the last 20-30 years. As such, a number of foundries are expanding their 28-nm capacity to capitalize on end customers that will benefit from moving to the optimal performance/cost delivered at this node. Going forward, leading technologies such as LSA are essential to meet the requirements for future device scaling," according to Dr. Handel H. Jones, founder and CEO of International Business Strategies, Inc.
Arthur W. Zafiropoulo, Ultratech Chairman and Chief Executive Officer, said, "The industry is experiencing a second wave of growth driving the 28-nm logic manufacturing arena. This order is another example of this growth, which is expected to continue driven by Asia's internal high demand for low-cost chips for mobile devices. As the production requirements for 28-nm processing continues, Ultratech is working closely with our customers to help them meet this demand. We value our strong relationships with our global customer base and work to provide advanced technology solutions that meet our customers' product roadmaps, along with strong local support teams to enable high-volume production ramps."
Ultratech Laser Spike Anneal Systems
Built on the customizable Unity Platform™, the LSA scanning systems have fundamental advantages in uniformity and low-stress processing. The systems' short dwell time capability, along with excellent process control, delivers superior within-die uniformity and layout-independent process results allowing customers to achieve improved device performance, lower leakage, and improved yield. Ultratech's flagship platform, the LSA101, delivers high flexibility and extendibility for advanced annealing applications and is currently in high-volume production for 28-nm and below logic devices.