Mar 9 2016
M/A-COM Technology Solutions Inc. (“MACOM”), a leading supplier of high-performance RF, microwave, millimeterwave and photonic semiconductor products, today announced the MAOP-L284CN, a silicon photonic integrated circuit integrated with lasers (L-PIC™) for a 100G transmit solution for CWDM4 and CLR4 applications.
MACOM's MAOP-L284CN features four high bandwidth Mach-Zehnder modulators integrated with four lasers (1270, 1290, 1310, and 1330 nm) and a CWDM multiplexer, with each channel operating at up to 28 Gb/s.
To meet the explosive growth of data traffic driven by video and mobile, major Internet content providers, such as Amazon, Microsoft, Google and Facebook, are building hyper-scale datacenters, which require high-speed interconnect solutions that are power efficient, compact and cost optimized. MACOM’s Etched Facet Technology (EFT) lasers are attached to the Silicon PIC using its proprietary Self-Alignment process (SAEFT™) with high coupling efficiency, offering a power efficient solution at reduced manufacturing cost.
MACOM’s MAOP-L284CN features four high bandwidth Mach-Zehnder modulators integrated with four lasers (1270, 1290, 1310, and 1330 nm) and a CWDM multiplexer, with each channel operating at up to 28 Gb/s. The L-PIC™ operates on a standard single mode optical fiber, and includes integrated tap detectors for fiber alignment, system initialization and closed loop control. A single fiber aligned to the output edge coupler of this 4.1 x 6.5 mm die is the only optical requirement for implementing this device into QSFP28 transceiver applications. MACOM is also offering the MASC-37053A modulator driver integrated with CDR, matched with this L-PIC™ for optimized performance and power dissipation.
“Silicon-based photonic integrated circuits, or PICs, enable integration of optical devices such as modulators and multiplexer onto a single chip. We believe that MACOM’s L-PIC™ solves the key challenge of aligning lasers to the silicon PIC with high yield and high coupling efficiency, making the adoption of Silicon PICs a reality for high-speed optical interconnects within the Datacenter,” said Vivek Rajgarhia, Vice President of Strategy, High-Speed Networking, for MACOM.
MACOM’s L-PIC™ will be on display for private demonstrations at OFC 2016, Booth #3101, March 22-24th in Anaheim, CA. To make an appointment, contact your local sales representative. For more information on MACOM’s broad optical and photonic portfolio at OFC click here.