Feb 25 2016
II‐VI Incorporated, a leading provider of pump laser modules for terrestrial and submarine optical networks, today announced the general availability of its high power, 2 x 810 mW, dual 980 nm pump laser module.
Growing global demand for bandwidth is driving the need to scale the optical communications infrastructure with greater economy and efficiency. II-VI’s dual-chip, dual-output, pump laser modules enable designers to replace two laser modules with one. Housed within the compact 10-pin mini-butterfly package, they consume less electrical power, generate less heat and enable significant reductions in the size of high performance, multi-stage optical amplifier designs.
“II-VI’s 980 nm pump laser technology, now entering its third decade of innovation, continues to meet the evolving needs of the market,” said Dr. Sanjai Parthasarathi, Vice President, Product Marketing and Strategy, Optical Communications Group. “The established, proven building blocks of very high power semiconductor lasers, compact module packaging and unique, independent dual-laser output designs come together in this new product to minimize the physical size and carbon footprint of optical networking equipment as they continue to be deployed in greater numbers.”
This new product leverages II-VI’s proven, high-reliability GaAs laser technology platform and wafer fabrication facility in Zurich, Switzerland. Telcordia qualification testing has been completed and production is ramping up to serve several customers.
About II-VI Incorporated
II-VI Incorporated, a global leader in engineered materials and opto-electronic components is a vertically integrated manufacturing company that develops innovative products for diversified applications in the industrial, optical communications, military, life sciences, semiconductor equipment, and consumer markets. Headquartered in Saxonburg, Pennsylvania, with research and development, manufacturing, sales, service, and distribution facilities worldwide, the Company produces a wide variety of application-specific photonic and electronic materials and components, and deploys them in various forms including integrated with advanced software to enable our customers.