Toshiba Corporation today announced that it will expand its lineup of photorelays in the industry’s smallest[1] package with the addition of four products: “TLP3417”, “TLP3420”, “TLP3440” and “TLP3475.” Mass production shipment starts from today. The new products are suited for system solutions in various applications, including semiconductor testers, measurement equipment, probe cards and medical equipment.
Toshiba: Photorelays in Industry's Smallest VSON4 Package (Photo: Business Wire)
The new products utilize the industry's smallest package for photocouplers, the Toshiba-developed VSON4[2] package. Compared to equivalent Toshiba products in a USOP4 package, the new photorelays reduce the assembly area by 50% and volume by 60%, which can contribute to enhancing high density assembly.
“TLP3440” has improved leakage characteristics against high frequency at off-state, while “TLP3475” has improved high speed signal transmission characteristics at on-state. Also, for high voltage measurement requirements including SoC testing,“TLP3417” supports 80V, while “TLP3420” supports 100V. The new products have the same electrical characteristics as the conventional Toshiba USOP4 series products; “TLP3317,” “TLP3320,” “TLP3340” and “TLP3375,” making it easier to evaluate them as replacement products.
Notes:
[1] For photocoupler products, as of September 8, 2014. Toshiba survey.
[2] VSON: Very Small Outline Non-leaded.
Follow this link for more on Toshiba photocouplers and photorelays.
http://www.semicon.toshiba.co.jp/eng/product/opto/coupler/index.html