Dec 28 2010
Oxford Instruments Plasma Technology, provider of plasma tools, has launched a new series of plasma deposition and etch tools that offer valuable advantages for high-brightness LED (HBLED) developers.
The PlasmaPro NGP1000 tools deliver enhanced throughput along with improved device performance. The tools also have various batch sizes ranging from 61 x 2” wafers to 7 x 6” wafers.
The NGP1000 series enables users to decrease ownership expenses, enhance uptime and improve throughput. The NGP1000 platform is optimized for batch production and features a vacuum load lock as the standard.
The NGP1000 PECVD solution includes an optimized showerhead design and a large area electrode. It is designed for depositing SiNx and SiO2 layers and enables a maximum of 7 x 6”, 15 x 4”, or 61 x 2” in one load. The NGP1000 etch system provides maximum batch sizes of 5 x 6”, 13 x 4”, or 55 x 2” and is designed for Sapphire, AlGaInP, and GaN etch.
Enhanced uniformity over large regions is offered by the 60 MHz Viper plasma source. The plasma source attains plasma densities similar to ICP sources and maintains the advantages of low damage and high etch rates.