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CHAD Develops Wafer-Handling Capabilities for LED Process Tools

CHAD Industries announced the development of wafer-handling capabilities for LED process tools. With increased production demand for LED products, original equipment manufacturers are expected to offer automated products for their process tool. CHAD has configured the WaferMate200 workcell to allow 6'', 4'' and 2'' sapphire wafer-handling requirements.

WaferMate200 workcell

At the San Francisco’s SemiconWest show, CHAD demonstrated the sapphire wafer-handling capabilities. During the show, the WaferMate200 workcell was configured to handle 2'' sapphire wafers. The workcell loaded and unloaded the 3D non-contact ContourGT-X8 inspection tool from Veeco Instruments.

The LED wafer handling devices are ideal for using in solder bumping, stud bumping, and metrology measurement and inspection.

CHAD Industries’ President, Scott Klimczak, stated that the company has designed a set of tooling options to facilitate a range of LED applications by utilizing the WaferMate200. This approach enables OEM customers to focus on the process tool, while allowing the company to focus on wafer automation, Klimczak said.

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