At this year’s Semicon Taiwan, from September 9 to 11 in Taipei, SUSS MicroTec, a leading supplier of process and test solutions for the semiconductor industry, introduces the XBC300 Production Wafer Bonder for the CMOS Image Sensor (CIS) market. Visitors will have the opportunity to learn more about the world’s first wafer bonder product family specifically designed for CMOS Image Sensor production.
Silicon Laboratories Inc., a leader in high-performance, analog-intensive, mixed-signal ICs, today announced its entry into the consumer timing market with the introduction of the industry's highest stability 100 percent CMOS oscillator, offering a replacement for crystal oscillators (XOs) with shorter lead times, lower cost, higher reliability and higher performance.
Addressing the burgeoning market for energy-saving, environmentally friendly light-emitting diode (LED) technology, Freescale Semiconductor is now sampling the first LED backlight product in its power management IC portfolio. The new 10-channel MC34844 white LED driver IC is designed for LED backlights in notebook computers, as well as in flat-panel monitors with screen sizes ranging from 10 inches to 27 inches.
CIP Technologies (CIP) has today announced the official launch of its HyBoard(TM) hybrid Photonic Integrated Circuit (PIC) platform. The launch will feature a live demonstration of a multichannel DWDM laser module producing 16 independent wavelengths on a 50GHz grid at the company's booth (#263), at ECOC 2008.
The Infrared Data Association (IrDA) which establishes infrared standards that provide convenient wireless connectivity and the Visible Light Communications Consortium (VLCC) which is working on research, development, and the standardization of safe visible light communications (VLC) announce a cooperative agreement between the two organizations. This agreement recognizes the synergies between the organizations and the potential to cooperate in the promotion of optoelectronic technologies such as infrared and visible light communications.
Aviza Technology, Inc., a supplier of advanced semiconductor capital equipment and process technologies for the global semiconductor industry and related markets, today announced that it has received multiple orders from one of the world's leading optoelectronics manufacturers. The customer will use the Delta i2L PECVD and Omega i2L etch systems to produce GaAs and InGaN-based LED devices, such as High Brightness LEDs (HB-LEDs), used in solid state lighting, mobile communications and automotive applications.
Cymer, Inc., the market's leading developer of light sources used to create advanced semiconductor chips, has unveiled the XLR 500d-an argon fluoride (ArF) laser light source for 32 nanometer (nm) dry lithography. Expanding Cymer's market leadership with the adoption of its XLR technology, the XLR 500d offers advanced capabilities developed in the XLR 500i for advanced ArF immersion lithography.
Taiwan's sales of new energy-efficient lights soared during the first half of this year, helped by the Beijing Olympics and higher energy prices that are encouraging the use of lower-cost lighting. Taiwan's light-emitting diode (LED) makers reported that their sales rose 16.1 percent in the first half of this year from the same period a year earlier.
NeoPhotonics today announced in conjunction with the China International Optoelectronic Exposition (CIOE) that sales figures from 2006 thru 2Q 2008 have established the company as a top supplier of optical components -- for fiber access, metro and long-haul optical network equipment -- to Huawei, one of the world's largest suppliers of telecommunications network equipment (Huawei reported contract sales of US $16 billion in 2007).
More than 130 openings for Mainland China interns, graduates and engineers are on offer at Hong Kong Science Park (HKSP).
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