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Gallium Nitride Transistors Enable More Compact LED Lamps with Increased Light Output

LEDs are durable and save energy. Now researchers have found a way to make LED lamps even more compact while supplying more light than commercially available models. The key to success: transistors made of the semiconductor material gallium nitride.

From Fraunhofer USA, Inc. 5 Mar 2014

Supertex Debuts High Voltage LED Driver IC

Supertex, a recognized leader in high voltage analog and mixed signal integrated circuits (ICs), today introduced the HV9805, an LED driver IC, where the LED light source is arranged as a high voltage LED string in order to accommodate certain lamp form factors, while allowing for cost savings through less complicated cooling and optical arrangements.

26 Feb 2014

Silicon Image Introduces High-Throughput, Single-Chip CMOS Beam-Steering 60GHz RF Transceivers

Silicon Image, a leading provider of advanced connectivity solutions, today announced its entry into the small cell wireless backhaul market with the introduction of two high-throughput, single-chip CMOS beam-steering 60GHz RF transceivers designed to address the rapidly growing market for high-capacity wireless backhaul links in urban environments.

24 Feb 2014

New DLP Pico Chipset from Texas Instruments Delivers Bright, Vivid HD Image Quality

Today at Mobile World Congress, Texas Instruments released the 0.3" HD Tilt & Roll Pixel (TRP) DLP® Pico™ chipset, its smallest, most power-efficient micro-mirror array, which can generate high-definition (HD) displays from compact electronics, including tablets, smartphones, accessories, wearable displays, augmented reality displays, interactive surface computing, digital signage and control panels. Based on proven DLP Cinema® technology, this new DLP Pico chipset delivers bright, vivid HD image quality.

24 Feb 2014

New Low-Height SO6L Package Gate-Drive Photocouplers from Toshiba

Toshiba Corporation today announced the launch of low-height SO6L package gate-drive photocouplers for use in driving small- to medium-power IGBTs and power MOSFETs. Mass production is scheduled for the end of January.

30 Jan 2014

Altera to Exhibit Innovative Solutions at DesignCon 2014

Altera Corporation will discuss how its innovations in semiconductor design are paving the way for its Generation 10 products to enable the evolution of next-generation networks at DesignCon 2014.

28 Jan 2014

TSMC Honors Gigaphoton Taiwan at Supplier Service Appreciation Ceremony

Gigaphoton Taiwan Inc., local subsidiary of Gigaphoton Inc. (Head office: Oyama-shi, Tochigi-ken, President & CEO: Hitoshi Tomaru) was commended and received a letter of appreciation from each Fab for the special contribution to TSMC as a supplier at the Supplier Service Appreciation Ceremony held at Fab 12 and Fab 14 at TSMC (Taiwan Semiconductor Manufacturing Company, Limited) in November and December 2013.

27 Jan 2014

Teracom Selects Broadcom for Demonstration of 4K Ultra HD and DVB-T2 Broadcast Capabilities with Boxer TV

Teracom TV-Puls - Broadcom Corporation, a global innovation leader in semiconductor solutions for wired and wireless communications, today announced that Teracom, a provider of terrestrial network operations in Sweden and Denmark, has selected Broadcom® silicon to demonstrate 4K Ultra HD and DVB-T2 broadcast capabilities with Boxer TV at its TV-Puls event on January 24, 2014 Visit www.broadcom.com to learn more.

27 Jan 2014

Toshiba to Begin Sample Shipments of TCM9518MD Dual Camera Module

Toshiba Corporation today announced that it will start sample shipments of “TCM9518MD”, for application in smartphones, tablets and other mobile devices, on January 31, 2014. The new product is the industry's first dual camera module to incorporate twin 1/4 inch optical format 5-megapixel CMOS camera modules (5 megapixels x 2 arrays), which simultaneously outputs recorded images and depth data.

20 Dec 2013

Global Photonic IC Market Expected to Grow at 27.7% CAGR During 2012-2016

Research and Markets has announced the addition of the "Global Photonic IC Market 2012-2016" report to their offering.

20 Dec 2013

Featured Equipment

Advanced F-Theta Lenses for Precision Imaging Systems

These F-theta lenses by Avantier are designed for consistent spot size and uniform field curvature correction, ideal for high-resolution imaging applications.

From Avantier Inc.

Off-Axis Parabolic (OAP) Mirrors: Precision Solutions for Advanced Optical Systems

Shanghai Optics provides high-precision off-axis parabolic (OAP) mirrors designed for advanced optical systems, offering superior reflective solutions for applications requiring precise light collimation and focus.

From Shanghai Optics