Sep 15 2010
Fujifilm announced that it will demonstrate the new, advanced B2 Direct Laser Engraving (DLE) Flexo CTP System at the Labelexpo Americas 2010 in the U.S. The company, had earlier unveiled the system in Europe at the FachPack 2010 expo, Nuremburg.
Fujifilm has brought a new solution for flexo packaging and label print applications, by developing a new multi-channel CTP platesetter and a DLE plate. The DLE Flexo CTP System offers various benefits because of its distinct imaging and plate technologies.
The DLE Flexo CTP System offers a simple plate production method that removes the need of multi-stage processing, which is necessary for the present Laser Ablation Mask technologies. The system provides effective thermal decomposition reaction in the plate areas that are exposed, along with the multi-channel imaging technology. This results in high productivity.
The plate, which has been developed using a polymerization reaction, provides fine and sharp image reproduction. The DLE technology eradicates the requirement for expensive UV exposure devices. The system is completely free of solvents and VOCs. Without the need for high temperature, lengthy drying process, both greenhouse gas emissions and consumption of energy are reduced.