The Zeta-300 optical profiler is a non-contact 3D surface topography measurement system. The Zeta-300 enhances the Zeta-20 3D profiler's capabilities by introducing extra isolation choices and versatile configurations for accommodating larger samples.
The 3D optical metrology system has been powered by patented ZDotTM technology and Multi-Mode optics. This allows measurement of a range of samples: opaque and transparent, smooth to rough texture, low to high reflectance, and step heights from nanometers to millimeters.
The Zeta-300 optical profiler non-contact measurement system combines six optical metrology technologies in a configurable and user-friendly system.
ZDot measurement mode helps gather a high-resolution 3D optical scan and a True Color infinite focus image. Other 3D optical metrology methods include white light interferometry, shearing interferometry, and Nomarski interference contrast microscopy.
It is possible to measure film thickness with ZDot or a combined broadband reflectometer. The Zeta-300 is a high-end microscope that could be utilized for sample review or automated defect inspection.
The availability of the Zeta-300 3D profiler assists both R&D and production environments by offering extensive roughness, step height, film thickness measurements, and defect inspection capability.
Image Credit: KLA Instruments™
Features
- User-friendly optical profiler with Zdot and Multi-Mode optics for diverse applications
- High-quality microscope sample review and defect inspection capabilities
- ZI: White light interferometry (PSI and VSI) for precise wide-area measurements
- ZIC: Interference contrast for detailed 3D data of ultra-smooth surfaces
- ZDot: Collects high-res 3D scan and True Color infinite focus image simultaneously
- ZSI: Shearing interferometry for high-resolution images
- ZFT: Measures film thickness and reflectance using an integrated broadband reflectometer
- AOI: Automatic optical inspection to quantify sample defects
- Production capability: completely automated measurements with sequencing and pattern recognition
Image Credit: KLA Instruments™
Applications
- Step Height: Measures 3D step height from nanometers to millimeters.
- Texture: Analyzes 3D roughness and waviness on surfaces ranging from smooth to very rough.
- Stress: Assesses 2D thin film stress.
- Form: Evaluates 3D bow and shape characteristics.
- Defect Inspection: Identifies defects larger than 1 µm.
- Film Thickness: Measures transparent film thickness within 30 nm to 100 µm.
- Defect Review: Uses KLARF files to pinpoint and measure 3D surface topography or note defect locations.
Image Credit: KLA Instruments™
Industries
- LED: light emitting diodes and PSS (patterned sapphire substrates)
- Semiconductor and compound semiconductor
- Semiconductor WLCSP (wafer-level chip scale packaging)
- Semiconductor FOWLP (fan-out wafer-level packaging)
- PCB (printed circuit board) and flexible PCB
- MEMS: Micro-electro-mechanical systems
- Medical devices and microfluidic devices
- Data storage
- Universities, research labs, and institutes
Image Credit: KLA Instruments™