AssemblyLine systems, which are high-precision, alignment and assembly machine solutions, are developed for automated manufacture (align-and-attach) of photonic devices.
They exclusively integrate flexible attachment configurations and fast-active alignment with a tried and tested software control interface, encompassed in an industry-standard design. Optional modules offer additional features, and the high-end models offer wafer processing capability, optical test modules, and automatic tool changing.
New, next-generation in-line assembly systems from ficonTEC incorporate a redesigned platform (400, 800, 1200, 1600). They come in particular in-line configurations as an all-around and individual production cell for existing production lines. Alternatively, it is also possible to supply them as task-optimized production segments that consist of various distinctly configured systems. In principal, it is possible to visualize even entire production lines.
Software Control
ProcessControlMaster (PCM) from ficonTEC is a process-oriented, user-friendly application software and control interface that is available with all multi-machine configurations and turnkey systems. PCM incorporates an insightful UI with all high-resolution positioning, machine vision, and system management routines needed for reliable and repeatable driving of passive/active alignment and attachment/bonding process hardware. It is also already completely enabled for automated electro-optical test and characterization tasks. It can also operate and monitor single lines, and even sync parallel lines remotely.
Key Features
- Fully-automated photonic device assembly
- Configurable closed-loop fast-active alignment
- High-precision AUTOALIGN multi-axis motion
- Multiple chip and wafer handling options
- Epoxy dispensing, curing, and shrinkage control
General Tasks and Applications
- Pick-and-place
- Thermal or UV curing
- Precision adhesive dispensing
- Chip-to-package assembly
- Active mirror align-and-attach
- Fiber/FAC/SAC align-and-attach
- HPLD module assembly
- Active VBG spectral tuning
- Hybrid integrated photonics
- PICs, silicon photonics
Modular, Flexible and (Re-)Configurable
- FAB and HVM-ready — parallelizable and scalable
- Sophisticated feed IN/OUT options
- Daisy-chain multiple systems for production segments
- Single systems slot into existing production lines
- Add and/or swap modules for reconfiguration and repurposing
- Operate, monitor, and sync parallel lines remotely
| |
A400 |
A800 |
A1200 |
A1600 |
| Motion System |
4-axis alignment |
Gantry system with min. 6-axis high-precision alignment* |
Gantry system with min. 6-axis high-precision alignment*
OR
Cantilever system w/o multi-axis system |
Cantilever system with min. 6-axis high-precision alignment* |
Working Area (max)
(w x b x h, mm) |
100 x 200 x 200 |
100 x 300 x 50** |
200 x 300 x 50** |
200 x 100 x 50** |
| Handling Options |
Single conveyor |
Single or dual conveyor |
| Wafer Capable |
No |
Up to 6” |
Up to 12” |
| Machine Vision |
Standard/dual positioning and observation camera options |
| Feed Options |
Suitable for Jedec or Auer boats, or for customer trays |
| Software Features |
Ergonomic, flexible and powerful process software – extended operator-less control – remote control server option |
| Physical Features |
Rugged steel-base production cell - access door lifts vertically without affecting footprint |
| Minimum connections |
400 VAC (or country specific), air/vacuum, 100 Mbit/s network |
| Cleanroom compliance |
ISO 6*** |
Dimensions
(w x b x h, mm) |
400 x 1200 x 1600/2000 |
800 x 1200 x 1600/2000 |
1200 x 1200 x 1600/2000 |
1600 x 1200 x 1600/2000 |
| Weight (typ., kg) |
600 |
1300 |
1800 |
2500 |
*alternative multi-axis configurations optional
**working area with 6-axis system
***others available on request
Automated Photonic Device Assembly with Modular System Approach
Assembly line systems - Picture 1
Assembly line systems - Picture 2
Assembly line systems - Picture 3
High-precision alignment unit