Oct 4 2010
Heavy Reading has released a new report titled ‘Chip Makers Gear Up for Packet-Optical Deployments’. The report examines the current developments for OTN mapper/ framer devices and technologies, and integrated packet-optical devices. The study recognizes the major requirements of these technologies and highlights their benefits for equipment manufacturers.
The report provides a comprehensive data on the availability of components, flexibility, performance and reviewing features. The research report profiles 12 vendors in the market sector and includes over 30 devices.
According to the report, component suppliers are gearing up for commercial production of a wide range of products, which will allow the telecom industry to shift to packet-optical transport systems in the next five years. The 40 nm technology allows the integration of micro optical transport platforms on a chip.
Telecom equipment providers and carriers are focusing on packet-optical transport platforms. Multiple vendors are currently developing 100 Gbit/s ODU4 devices, and the first silicon is scheduled for release in 2011. Vendors are handling the shipment of high integrated ASSP devices, which are currently under development.